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  • Seipone sa aluminium bakeng sa lebone la Slit

    Seipone sa aluminium bakeng sa lebone la Slit

    Substrate: B270®
    0.1mm
    Ho mamella ho ferekana:0.1mm
    3WER 3 :)@632.8nm

    TLHOKOMELISO:Lefatše le lefifi la 0.3mm Max. Bophara bo felletseng
    Bokantle:Fatše le ho fifala
    Aperture e hlakileng:90%
    <5 "
    Coating:Aluminum Covertures, R> 90% @ 430-6-670nm, Aoi = 45 °

    botsaLintlha